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MT62F2G32D8DS-031WT:B

Micron Technology

Micron Technology MT62F2G32D8DS-031WT:B
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Width (mm)
    12.4
  • Access Mode
    MULTI BANK PAGE BURST
  • Length (mm)
    15
  • JESD-30 Code
    R-PBGA-B315
  • Memory Width
    32
  • Package Code
    TFBGA
  • Self Refresh
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    LPDDR5 DRAM
  • Operating Mode
    SYNCHRONOUS
  • Refresh Cycles
    8192
  • Number of Ports
    1
  • Terminal Position
    BOTTOM
  • Additional Feature
    AUTO/SELF REFRESH
  • Memory Organization
    2GX32
  • Number of Functions
    1
  • Number of Terminals
    315
  • Terminal Pitch (mm)
    0.8
  • Number of Words Code
    2G
  • Memory Density (bits)
    68719476736
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.1
  • Supply Voltage-Max (V)
    1.95
  • Supply Voltage-Min (V)
    1.7
  • Supply Voltage-Nom (V)
    1.8
  • Number of Words (words)
    2147483648
  • Sequential Burst Length
    16,32
  • Supply Current-Max (mA)
    360
  • Interleaved Burst Length
    16,32
  • Package Equivalence Code
    BGA315,15X21,32/28
  • Clock Frequency-Max (MHz)
    3195
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -25

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MT62F2G32D8DS-031WT:B