ProductsManufacturers
Events
Send an RFQBOM Tool

MT62F1G32D4DR-031IT:B

Micron Technology

Micron Technology MT62F1G32D4DR-031IT:B
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.36
  • SB Code
    8542.32.00.23
  • Width
    12.4 mm
  • Length
    15 mm
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Access Mode
    MULTI BANK PAGE BURST
  • JESD-30 Code
    R-PBGA-B315
  • Memory Width
    32
  • Organization
    1GX32
  • Package Code
    TFBGA
  • Self Refresh
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    34359738368 bit
  • Memory IC Type
    LPDDR5 DRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    0.8 mm
  • Number of Ports
    1
  • Number of Words
    1073741824 words
  • Seated Height-Max
    1.1 mm
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    315
  • Number of Words Code
    1G
  • Package Body Material
    PLASTIC/EPOXY
  • Sequential Burst Length
    16,32
  • Interleaved Burst Length
    16,32
  • Package Equivalence Code
    BGA315,15X21,32
  • Operating Temperature-Max
    95 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    1.95 V
  • Supply Voltage-Min (Vsup)
    1.7 V
  • Supply Voltage-Nom (Vsup)
    1.8 V

0 suppliers available to buy or to bid for MT62F1G32D4DR-031IT:B

Send an RFQ

Your RFQ will be directly sent to our expert: Ayesha

Send an RFQ
MT62F1G32D4DR-031IT:B
Send an RFQ
MT62F1G32D4DR-031IT:B