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MT58LC64K32B3S27BDC3-9

Micron Technology

Micron Technology MT58LC64K32B3S27BDC3-9
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • JESD-30 Code
    X-XUUC-N93
  • Memory Width
    32
  • Package Code
    DIE
  • Output Enable
    YES
  • Package Shape
    UNSPECIFIED
  • Package Style
    UNCASED CHIP Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • Memory IC Type
    STANDARD SRAM
  • Operating Mode
    SYNCHRONOUS
  • Number of Ports
    1
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    UPPER
  • Memory Organization
    64KX32
  • Number of Functions
    1
  • Number of Terminals
    93
  • Number of Words Code
    64K
  • Memory Density (bits)
    2097152
  • Package Body Material
    UNSPECIFIED
  • Output Characteristics
    3-STATE
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3.135
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    65536
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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MT58LC64K32B3S27BDC3-9