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MT49H64M9CFM-33

Micron Technology

Micron Technology MT49H64M9CFM-33
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.32
  • SB Code
    8542.32.00.15
  • I/O Type
    SEPARATE
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B144
  • Memory Width
    9
  • Organization
    64MX9
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    603979776 bit
  • Memory IC Type
    DDR DRAM
  • Terminal Pitch
    0.8 mm
  • Access Time-Max
    0.25 ns
  • Number of Words
    67108864 words
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    819 mA
  • Number of Terminals
    144
  • Standby Current-Max
    0.048 Amp
  • Number of Words Code
    64M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Sequential Burst Length
    2,4,8
  • Interleaved Burst Length
    2,4,8
  • Package Equivalence Code
    BGA144,12X18,40/32
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Clock Frequency-Max (fCLK)
    300 MHz

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MT49H64M9CFM-33
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MT49H64M9CFM-33