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MT47H64M8CB-3E

Micron Technology

Micron Technology MT47H64M8CB-3E
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.28
  • SB Code
    8542.32.00.15
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Width (mm)
    10
  • Length (mm)
    12
  • JESD-30 Code
    R-PBGA-B60
  • Memory Width
    8
  • Package Code
    FBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    DDR2 DRAM
  • Operating Mode
    SYNCHRONOUS
  • Refresh Cycles
    8192
  • Number of Ports
    1
  • DLA Qualification
    Not Qualified
  • Terminal Position
    BOTTOM
  • Memory Organization
    64MX8
  • Number of Functions
    1
  • Number of Terminals
    60
  • Terminal Pitch (mm)
    0.8
  • Access Time-Max (ns)
    0.45
  • Number of Words Code
    64M
  • Memory Density (bits)
    536870912
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    1.2
  • Supply Voltage-Max (V)
    1.9
  • Supply Voltage-Min (V)
    1.7
  • Supply Voltage-Nom (V)
    1.8
  • Number of Words (words)
    67108864
  • Sequential Burst Length
    4,8
  • Standby Current-Max (A)
    0.007
  • Supply Current-Max (mA)
    105
  • Interleaved Burst Length
    4,8
  • Package Equivalence Code
    BGA60,9X11,32
  • Clock Frequency-Max (MHz)
    333
  • Peak Reflow Temperature (Cel)
    260

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MT47H64M8CB-3E
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MT47H64M8CB-3E