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MT47H1G4THM-3:A

Micron Technology

Micron Technology MT47H1G4THM-3:A
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.36
  • SB Code
    8542.32.00.23
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B63
  • Memory Width
    4
  • Organization
    1GX4
  • Package Code
    FBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    4294967296 bit
  • Memory IC Type
    DDR2 DRAM
  • Refresh Cycles
    8192
  • Terminal Pitch
    0.8 mm
  • Number of Words
    1073741824 words
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    353 mA
  • Number of Terminals
    63
  • Standby Current-Max
    0.016 Amp
  • Number of Words Code
    1G
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    BGA63,9X11,32
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Nom (Vsup)
    1.8 V

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