ProductsManufacturers
Events
Send an RFQBOM Tool

MT46V32M16D1TG-75

Micron Technology

Micron Technology MT46V32M16D1TG-75
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.28
  • SB Code
    8542.32.00.15
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G66
  • Memory Width
    16
  • Package Code
    TSSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Memory IC Type
    DDR1 DRAM
  • Refresh Cycles
    8192
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Memory Organization
    32MX16
  • Number of Terminals
    66
  • Terminal Pitch (mm)
    0.635
  • Access Time-Max (ns)
    0.75
  • Number of Words Code
    32M
  • Memory Density (bits)
    536870912
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Supply Voltage-Nom (V)
    2.5
  • Number of Words (words)
    33554432
  • Sequential Burst Length
    2,4,8
  • Standby Current-Max (A)
    0.003
  • Interleaved Burst Length
    2,4,8
  • Package Equivalence Code
    TSSOP66,.46
  • Clock Frequency-Max (MHz)
    133
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

0 suppliers available to buy or to bid for MT46V32M16D1TG-75

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
MT46V32M16D1TG-75
Send an RFQ
MT46V32M16D1TG-75