MT45W4MV16BBB-856LWT

Micron Technology

Micron Technology MT45W4MV16BBB-856LWT
  • ECCN
    3A991.B.2.A
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Width
    6 mm
  • Length
    8 mm
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B54
  • Memory Width
    16
  • Organization
    4MX16
  • Package Code
    VFBGA
  • JESD-609 Code
    e1
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    67108864 bit
  • Memory IC Type
    PSEUDO STATIC RAM
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    0.75 mm
  • Access Time-Max
    85 ns
  • Number of Words
    4194304 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN SILVER COPPER
  • Seated Height-Max
    1 mm
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Additional Feature
    SYNCHRONOUS BURST MODE POSSIBLE
  • Supply Current-Max
    30 mA
  • Number of Functions
    1
  • Number of Terminals
    54
  • Standby Current-Max
    0.0001 Amp
  • Number of Words Code
    4M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    BGA54,6X9,30
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -25 Cel
  • Supply Voltage-Max (Vsup)
    1.95 V
  • Supply Voltage-Min (Vsup)
    1.7 V
  • Supply Voltage-Nom (Vsup)
    1.8 V
  • Peak Reflow Temperature (Cel)
    260

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MT45W4MV16BBB-856LWT