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MSM83C55-XXGS

LAPIS Semiconductor Co., Ltd.

LAPIS Semiconductor Co., Ltd. MSM83C55-XXGS
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    S-PQFP-G44
  • Memory Width
    8
  • Package Code
    QFP
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Memory IC Type
    MASK ROM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    SERIAL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Memory Organization
    128KX8
  • Number of Functions
    1
  • Number of Terminals
    44
  • Terminal Pitch (mm)
    0.8
  • Access Time-Max (ns)
    100
  • Number of Words Code
    2K
  • Memory Density (bits)
    1048576
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    2048
  • Supply Current-Max (mA)
    25
  • Package Equivalence Code
    QFP44,.5SQ,32
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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MSM83C55-XXGS
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MSM83C55-XXGS