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MSM7582B

LAPIS Semiconductor Co., Ltd.

LAPIS Semiconductor Co., Ltd. MSM7582B
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G32
  • Package Code
    TSSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Terminal Pitch
    0.5 mm
  • Telecom IC Type
    MODEM
  • Temperature Grade
    OTHER
  • Terminal Position
    DUAL
  • Supply Current-Max
    0.028 mA
  • Number of Terminals
    32
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    TSSOP32,.56,20
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    -25 Cel

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MSM7582B
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MSM7582B