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MSM6888BGS-VK

LAPIS Semiconductor Co., Ltd.

LAPIS Semiconductor Co., Ltd. MSM6888BGS-VK
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • JESD-30 Code
    R-PQFP-G56
  • Package Code
    QFP
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Telecom IC Type
    DTMF SIGNALING CIRCUIT
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Number of Terminals
    56
  • Terminal Pitch (mm)
    1
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Current-Max (mA)
    10
  • Package Equivalence Code
    QFP56,.8X.94,40
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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MSM6888BGS-VK
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MSM6888BGS-VK