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MSM6597A-XXXGS-AK

LAPIS Semiconductor Co., Ltd.

LAPIS Semiconductor Co., Ltd. MSM6597A-XXXGS-AK
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Width
    5.62 mm
  • Length
    9.7 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G30
  • Memory Width
    1
  • Organization
    3MX1
  • Package Code
    SSOP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    3145728 bit
  • Memory IC Type
    MASK ROM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    0.65 mm
  • Access Time-Max
    1500 ns
  • Number of Words
    3145728 words
  • Parallel/Serial
    SERIAL
  • Terminal Finish
    TIN LEAD
  • Seated Height-Max
    1.85 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Supply Current-Max
    20 mA
  • Number of Functions
    1
  • Number of Terminals
    30
  • Standby Current-Max
    5.0E-5 Amp
  • Number of Words Code
    3M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    SSOP30,.3
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    5.5 V
  • Supply Voltage-Min (Vsup)
    3.5 V
  • Supply Voltage-Nom (Vsup)
    5 V

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MSM6597A-XXXGS-AK