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MSM6596XXXRS

LAPIS Semiconductor Co., Ltd.

LAPIS Semiconductor Co., Ltd. MSM6596XXXRS
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-PDIP-T18
  • Memory Width
    1
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Memory IC Type
    MASK ROM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    SERIAL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Memory Organization
    32MX1
  • Number of Functions
    1
  • Number of Terminals
    18
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    1500
  • Number of Words Code
    2M
  • Memory Density (bits)
    33554432
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    2097152
  • Standby Current-Max (A)
    1.0E-5
  • Supply Current-Max (mA)
    15
  • Package Equivalence Code
    DIP18,.3
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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MSM6596XXXRS
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MSM6596XXXRS