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MSM6595-XXXRS

LAPIS Semiconductor Co., Ltd.

LAPIS Semiconductor Co., Ltd. MSM6595-XXXRS
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-PDIP-T18
  • Memory Width
    1
  • Organization
    1MX1
  • Package Code
    DIP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory Density
    1048576 bit
  • Memory IC Type
    MASK ROM
  • Terminal Pitch
    2.54 mm
  • Access Time-Max
    1500 ns
  • Number of Words
    1048576 words
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Supply Current-Max
    15 mA
  • Number of Terminals
    18
  • Standby Current-Max
    1.0E-5 Amp
  • Number of Words Code
    1M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    DIP18,.3
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel

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MSM6595-XXXRS
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MSM6595-XXXRS