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MSM6595-XXXJS

LAPIS Semiconductor Co., Ltd.

LAPIS Semiconductor Co., Ltd. MSM6595-XXXJS
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-PQCC-J18
  • Memory Width
    1
  • Package Code
    QCCJ
  • Package Shape
    RECTANGULAR
  • Package Style
    CHIP CARRIER Meter
  • Surface Mount
    YES
  • Terminal Form
    J BEND
  • J-STD-609 Code
    e0
  • Memory IC Type
    MASK ROM
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Memory Organization
    1MX1
  • Number of Terminals
    18
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    1500
  • Number of Words Code
    1M
  • Memory Density (bits)
    1048576
  • Package Body Material
    PLASTIC/EPOXY
  • Number of Words (words)
    1048576
  • Standby Current-Max (A)
    1.0E-5
  • Supply Current-Max (mA)
    15
  • Package Equivalence Code
    LDCC18,.33X.53
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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MSM6595-XXXJS