MSM5716C50-60-GS-K by LAPIS Semiconductor Co., Ltd. | Sourcengine

LAPIS Semiconductor Co., Ltd. MSM5716C50-60-GS-K

Lifecycle status
Transferred
Description
Rambus DRAM, 2MX8, CMOS, PDSO72
Category
Semiconductors Memory ICs DRAMs RAMBUS DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.02
SB Code
8542.32.00.15

I/O Type
COMMON
Technology
CMOS
JESD-30 Code
R-PDSO-G72
Memory Width
8
Package Code
SSOP
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH Meter
Surface Mount
YES
Terminal Form
GULL WING
J-STD-609 Code
e0
Memory IC Type
RAMBUS DRAM
Terminal Finish
Tin/Lead (Sn/Pb)
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
DUAL
Memory Organization
2MX8
Number of Terminals
72
Terminal Pitch (mm)
0.635
Number of Words Code
2M
Memory Density (bits)
16777216
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Supply Voltage-Nom (V)
3.3
Number of Words (words)
2097152
Standby Current-Max (A)
0.001
Supply Current-Max (mA)
600
Package Equivalence Code
SSOP72,.5
Clock Frequency-Max (MHz)
300
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0