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MSM531642DGS-K

LAPIS Semiconductor Co., Ltd.

LAPIS Semiconductor Co., Ltd. MSM531642DGS-K
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G44
  • Memory Width
    16
  • Package Code
    SOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Memory IC Type
    MASK ROM
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Memory Organization
    1MX16
  • Number of Terminals
    44
  • Access Time-Max (ns)
    150
  • Number of Words Code
    1M
  • Memory Density (bits)
    16777216
  • Package Body Material
    PLASTIC/EPOXY
  • Number of Words (words)
    1048576
  • Standby Current-Max (A)
    1.0E-5
  • Supply Current-Max (mA)
    120
  • Package Equivalence Code
    SOP44(UNSPEC)
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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MSM531642DGS-K
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MSM531642DGS-K