ProductsManufacturers
Events
Send an RFQBOM Tool

MSM531001RS

LAPIS Semiconductor Co., Ltd.

LAPIS Semiconductor Co., Ltd. MSM531001RS
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-PDIP-T32
  • Memory Width
    8
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Memory IC Type
    MASK ROM
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Memory Organization
    128KX8
  • Number of Terminals
    32
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    120
  • Number of Words Code
    128K
  • Memory Density (bits)
    1048576
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    131072
  • Standby Current-Max (A)
    0.02
  • Supply Current-Max (mA)
    20
  • Package Equivalence Code
    DIP32,.6
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

0 suppliers available to buy or to bid for MSM531001RS

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
MSM531001RS
Send an RFQ
MSM531001RS