ProductsManufacturers
Events
Send an RFQBOM Tool

MSM3764-20AAS

LAPIS Semiconductor Co., Ltd.

LAPIS Semiconductor Co., Ltd. MSM3764-20AAS
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.02
  • SB Code
    8542.32.00.15
  • I/O Type
    SEPARATE
  • Technology
    MOS
  • JESD-30 Code
    R-XDIP-T16
  • Memory Width
    1
  • Organization
    64KX1
  • Package Code
    DIP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory Density
    65536 bit
  • Memory IC Type
    PAGE MODE DRAM
  • Refresh Cycles
    128
  • Terminal Pitch
    2.54 mm
  • Access Time-Max
    200 ns
  • Number of Words
    65536 words
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Number of Terminals
    16
  • Number of Words Code
    64K
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    DIP16,.3
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Nom (Vsup)
    5 V

0 suppliers available to buy or to bid for MSM3764-20AAS

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
MSM3764-20AAS
Send an RFQ
MSM3764-20AAS