MSD18STG8RAU by MPE-Garry GmbH | Sourcengine

MPE-Garry GmbH MSD18STG8RAU

Lifecycle status
Active
RoHS
RoHS compliant
REACH
REACH compliant
Description
IC Socket, DIP18, 18 Contact(s), 2.54mm Term Pitch, 2.54mm Row Spacing, Solder
Category
Interconnects Sockets and Chip Carriers

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8536.69.40.40
SB Code
8536.69.40.40

Contact Style
RND PIN-SKT
J-STD-609 Code
e3
Mounting Style
RIGHT ANGLE
Housing Material
THERMOPLASTIC
Termination Type
SOLDER
Additional Feature
ROHS COMPLIANT
Current Rating (A)
3
Device Socket Type
IC SOCKET
Number of Contacts
18
Body Breadth (inch)
0.2
Device Type Used On
DIP18
PCB Contact Pattern
RECTANGULAR
Terminal Pitch (mm)
2.54
Contact Finish - Mating
AU
Socket Body Depth (inch)
0.32
Mating Contact Pitch (inch)
0.1
Contact Finish - Termination
Tin (Sn)
PCB Contact Row Spacing (mm)
2.54
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55
Dielectric Withstanding Voltage (V)
1000VAC