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MSC8112TMP2400V

Freescale Semiconductor, Inc.

Freescale Semiconductor, Inc. MSC8112TMP2400V
  • ECCN
    3A991
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Format
    FLOATING POINT
  • Bit Size
    16
  • Technology
    CMOS
  • Width (mm)
    20
  • Length (mm)
    20
  • RAM (words)
    114688
  • JESD-30 Code
    S-PBGA-B431
  • Package Code
    FBGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Barrel Shifter
    NO
  • J-STD-609 Code
    e0
  • Low Power Mode
    YES
  • Terminal Finish
    Tin/Lead/Silver (Sn/Pb/Ag)
  • Address Bus Width
    32
  • DLA Qualification
    Not Qualified
  • Terminal Position
    BOTTOM
  • Number of Terminals
    431
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    3.3
  • Supply Voltage-Max (V)
    1.13
  • Supply Voltage-Min (V)
    1.07
  • Supply Voltage-Nom (V)
    1.1
  • External Data Bus Width
    64
  • Package Equivalence Code
    BGA431,23X23,32
  • Clock Frequency-Max (MHz)
    100
  • Internal Bus Architecture
    MULTIPLE
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    DIGITAL SIGNAL PROCESSOR, OTHER
  • Peak Reflow Temperature (Cel)
    250
  • Time@Peak Reflow Temperature-Max (s)
    30

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MSC8112TMP2400V