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MSC23132B-70DS8

LAPIS Semiconductor Co., Ltd.

LAPIS Semiconductor Co., Ltd. MSC23132B-70DS8
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.02
  • SB Code
    8542.32.00.15
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PSMA-N72
  • Memory Width
    32
  • Package Code
    SIMM
  • Self Refresh
    NO
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    NO
  • Terminal Form
    NO LEAD
  • Memory IC Type
    FAST PAGE DRAM MODULE
  • Refresh Cycles
    1024
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    SINGLE
  • Memory Organization
    1MX32
  • Number of Terminals
    72
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    70
  • Number of Words Code
    1M
  • Memory Density (bits)
    33554432
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    25.4
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    1048576
  • Standby Current-Max (A)
    0.008
  • Supply Current-Max (mA)
    720
  • Package Equivalence Code
    SSIM72
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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MSC23132B-70DS8
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MSC23132B-70DS8