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MR26V51203L-XXXMBE

LAPIS Semiconductor Co., Ltd.

LAPIS Semiconductor Co., Ltd. MR26V51203L-XXXMBE
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Width
    12.7 mm
  • Length
    28.6 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G70
  • Memory Width
    16
  • Organization
    32MX16
  • Package Code
    SSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    536870912 bit
  • Memory IC Type
    MASK ROM
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    0.8 mm
  • Access Time-Max
    120 ns
  • Number of Words
    33554432 words
  • Parallel/Serial
    PARALLEL
  • Seated Height-Max
    3.05 mm
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    70
  • Number of Words Code
    32M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    8
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    3 V
  • Supply Voltage-Nom (Vsup)
    3.3 V

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MR26V51203L-XXXMBE
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MR26V51203L-XXXMBE