MR26V25655J-XXXMB by LAPIS Semiconductor Co., Ltd. | Sourcengine

LAPIS Semiconductor Co., Ltd. MR26V25655J-XXXMB

Lifecycle status
Discontinued
Description
MASK ROM, 8MX32, 120ns, CMOS, PDSO70
Category
Semiconductors Memory ICs MASK ROMs MASK ROM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Width
12.7 mm
Length
28.6 mm
Technology
CMOS
JESD-30 Code
R-PDSO-G70
Memory Width
32
Organization
8MX32
Package Code
SSOP
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH Meter
Surface Mount
YES
Terminal Form
GULL WING
Memory Density
268435456 bit
Memory IC Type
MASK ROM
Operating Mode
ASYNCHRONOUS
Terminal Pitch
0.8 mm
Access Time-Max
120 ns
Number of Words
8388608 words
Parallel/Serial
PARALLEL
Seated Height-Max
3.05 mm
Temperature Grade
COMMERCIAL
Terminal Position
DUAL
Supply Current-Max
100 mA
Number of Functions
1
Number of Terminals
70
Standby Current-Max
5.0E-5 Amp
Number of Words Code
8M
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Alternate Memory Width
16
Package Equivalence Code
SOP70,.63,32
Operating Temperature-Max
70 Cel
Operating Temperature-Min
0 Cel
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
3.3 V