MR26V02G54R-XXXMB by LAPIS Semiconductor Co., Ltd. | Sourcengine

LAPIS Semiconductor Co., Ltd. MR26V02G54R-XXXMB

Lifecycle status
Discontinued
Description
MASK ROM, 2MX1, 1500ns, PDSO70
Category
Semiconductors Memory ICs MASK ROMs MASK ROM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

JESD-30 Code
R-PDSO-G70
Memory Width
1
Package Code
SSOP
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH Meter
Surface Mount
YES
Terminal Form
GULL WING
Memory IC Type
MASK ROM
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
DUAL
Memory Organization
2MX1
Number of Functions
1
Number of Terminals
70
Terminal Pitch (mm)
0.8
Access Time-Max (ns)
1500
Number of Words Code
8M
Memory Density (bits)
2097152
Package Body Material
PLASTIC/EPOXY
Alternate Memory Width
16
Supply Voltage-Max (V)
3.6
Supply Voltage-Min (V)
3
Number of Words (words)
8388608
Standby Current-Max (A)
0.045
Supply Current-Max (mA)
15
Package Equivalence Code
SOP70,.63,32
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0