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MR26V01G54R-XXXMB

LAPIS Semiconductor Co., Ltd.

LAPIS Semiconductor Co., Ltd. MR26V01G54R-XXXMB
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • JESD-30 Code
    R-PDSO-G70
  • Memory Width
    32
  • Package Code
    SSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory IC Type
    MASK ROM
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Memory Organization
    32MX32
  • Number of Terminals
    70
  • Terminal Pitch (mm)
    0.8
  • Access Time-Max (ns)
    105
  • Number of Words Code
    32M
  • Memory Density (bits)
    1073741824
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    16
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    33554432
  • Standby Current-Max (A)
    0.025
  • Supply Current-Max (mA)
    100
  • Package Equivalence Code
    SOP70,.63,32
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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MR26V01G54R-XXXMB
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MR26V01G54R-XXXMB