ProductsManufacturers
Events
Send an RFQBOM Tool

MPC850DEVR66BUR2

Freescale Semiconductor, Inc.

Freescale Semiconductor, Inc. MPC850DEVR66BUR2
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.25
  • Bit Size
    32
  • Technology
    CMOS
  • Speed (MHz)
    66
  • JESD-30 Code
    S-PBGA-B256
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    TIN SILVER COPPER
  • DLA Qualification
    Not Qualified
  • Terminal Position
    BOTTOM
  • Number of Terminals
    256
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom (V)
    3.3
  • Package Equivalence Code
    BGA256,16X16,50
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    40

0 suppliers available to buy or to bid for MPC850DEVR66BUR2

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
MPC850DEVR66BUR2
Send an RFQ
MPC850DEVR66BUR2