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MPC563MZP56

Freescale Semiconductor, Inc.

Freescale Semiconductor, Inc. MPC563MZP56
  • ECCN
    3A991.A.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Bit Size
    32
  • Technology
    CMOS
  • Width (mm)
    27
  • Length (mm)
    27
  • Speed (MHz)
    56
  • ADC Channels
    NO
  • DAC Channels
    NO
  • DMA Channels
    NO
  • JESD-30 Code
    S-PBGA-B388
  • PWM Channels
    NO
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Terminal Finish
    Tin/Lead/Silver (Sn62Pb36Ag2)
  • Address Bus Width
    24
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    AUTOMOTIVE
  • Terminal Position
    BOTTOM
  • Number of I/O Lines
    16
  • Number of Terminals
    388
  • Program Memory Type
    FLASH
  • Terminal Pitch (mm)
    1
  • Data RAM Size (bytes)
    32768
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.55
  • Supply Voltage-Max (V)
    2.7
  • Supply Voltage-Min (V)
    2.5
  • Supply Voltage-Nom (V)
    2.6
  • External Data Bus Width
    32
  • Package Equivalence Code
    BGA388,26X26,40
  • Clock Frequency-Max (MHz)
    20
  • Moisture Sensitivity Level
    3
  • Program Memory Size (words)
    524288
  • Program Memory Width (bits)
    8
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Peak Reflow Temperature (Cel)
    240
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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MPC563MZP56
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MPC563MZP56