ProductsManufacturers
Events
Send an RFQBOM Tool

MPC5553MVZ112R

Freescale Semiconductor, Inc.

Freescale Semiconductor, Inc. MPC5553MVZ112R
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.25
  • Bit Size
    32
  • Technology
    CMOS
  • Speed (MHz)
    112
  • JESD-30 Code
    S-PBGA-B324
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e3
  • Terminal Finish
    MATTE TIN
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    AUTOMOTIVE
  • Terminal Position
    BOTTOM
  • Number of Terminals
    324
  • Program Memory Type
    FLASH
  • Terminal Pitch (mm)
    1
  • Data RAM Size (bytes)
    65536
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Current-Max (mA)
    510
  • Package Equivalence Code
    BGA324,22X22,40
  • Moisture Sensitivity Level
    1
  • Program Memory Size (words)
    1572864
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40

0 suppliers available to buy or to bid for MPC5553MVZ112R

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
MPC5553MVZ112R
Send an RFQ
MPC5553MVZ112R