ProductsManufacturers
Events
Send an RFQBOM Tool

MP65DPAPE7-Q

RISE TECHNOLOGY CO

RISE TECHNOLOGY CO MP65DPAPE7-Q
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.30
  • Bit Size
    64
  • Technology
    CMOS
  • Speed (MHz)
    83
  • JESD-30 Code
    S-PBGA-B387
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    387
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA387,26X26,50
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

0 suppliers available to buy or to bid for MP65DPAPE7-Q

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
MP65DPAPE7-Q
Send an RFQ
MP65DPAPE7-Q