ProductsManufacturers
Events
Send an RFQBOM Tool

ML9208-XXMB

LAPIS Semiconductor Co., Ltd.

LAPIS Semiconductor Co., Ltd. ML9208-XXMB
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    10.7
  • Length (mm)
    26
  • JESD-30 Code
    R-PDSO-G64
  • Package Code
    SSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of Terminals
    64
  • Terminal Pitch (mm)
    0.8
  • Display Configuration
    5 X 7 DOT CHARACTER
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.5
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Clock Frequency-Max (MHz)
    2
  • uPs/uCs/Peripheral ICs Type
    DISPLAY CONTROLLER, FLUORESCENT
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

0 suppliers available to buy or to bid for ML9208-XXMB

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
ML9208-XXMB
Send an RFQ
ML9208-XXMB