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ML7055HB

LAPIS Semiconductor Co., Ltd.

ML7055HB Datasheet
LAPIS Semiconductor Co., Ltd. ML7055HB
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • Width (mm)
    4.72
  • Length (mm)
    4.9
  • JESD-30 Code
    R-PBGA-B63
  • Package Code
    VFLGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BUTT
  • Telecom IC Type
    TELECOM CIRCUIT
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    63
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    0.52
  • Supply Voltage-Nom (V)
    1.8
  • Package Equivalence Code
    BGA63,8X8,20
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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ML7055HB
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ML7055HB