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ML70512HB

LAPIS Semiconductor Co., Ltd.

LAPIS Semiconductor Co., Ltd. ML70512HB
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • Width (mm)
    6.22
  • Length (mm)
    6.22
  • JESD-30 Code
    S-PBGA-B83
  • Package Code
    VFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Telecom IC Type
    TELECOM CIRCUIT
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    83
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    0.52
  • Supply Voltage-Nom (V)
    1.8
  • Package Equivalence Code
    BGA83,10X10,20
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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ML70512HB
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ML70512HB