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ML2302

LAPIS Semiconductor Co., Ltd.

ML2302 Datasheet
LAPIS Semiconductor Co., Ltd. ML2302
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width (mm)
    6.2
  • Length (mm)
    6.5
  • JESD-30 Code
    R-PBGA-N71
  • Package Code
    VFLGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • Consumer IC Type
    SPEECH SYNTHESIZER WITH RCDG
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    71
  • On Chip Memory Type
    FIFO
  • Terminal Pitch (mm)
    0.65
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    0.52
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.7
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    -10

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ML2302