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ML22Q394-NNNMB

LAPIS Semiconductor Co., Ltd.

LAPIS Semiconductor Co., Ltd. ML22Q394-NNNMB
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width (mm)
    4.4
  • Length (mm)
    5
  • JESD-30 Code
    R-PDSO-G16
  • Package Code
    SSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Consumer IC Type
    SPEECH SYNTHESIZER
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    16
  • On Chip Memory Type
    ROM
  • Terminal Pitch (mm)
    0.65
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.25
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    2
  • Supply Current-Max (mA)
    10
  • Package Equivalence Code
    SSOP16,.25
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Screening Level / Reference Standard
    AEC-Q100

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ML22Q394-NNNMB
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ML22Q394-NNNMB