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ML22Q330-NNNMB

LAPIS Semiconductor Co., Ltd.

ML22Q330-NNNMB Datasheet
LAPIS Semiconductor Co., Ltd. ML22Q330-NNNMB
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width (mm)
    5.6
  • Application
    VOICE SYNTHESIS
  • Length (mm)
    9.7
  • JESD-30 Code
    R-PDSO-G30
  • Package Code
    SSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e6
  • Terminal Finish
    TIN BISMUTH
  • Consumer IC Type
    SPEECH SYNTHESIZER
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    30
  • On Chip Memory Type
    FLASH
  • Terminal Pitch (mm)
    0.65
  • Reading Time-Max (s)
    20
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.85
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    2.3
  • Supply Current-Max (mA)
    12
  • Package Equivalence Code
    SSOP30,.3
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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ML22Q330-NNNMB
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ML22Q330-NNNMB