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ML22Q321-XXXMB

LAPIS Semiconductor Co., Ltd.

LAPIS Semiconductor Co., Ltd. ML22Q321-XXXMB
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • JESD-30 Code
    R-PDSO-G30
  • Package Code
    SSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Consumer IC Type
    SPEECH SYNTHESIZER WITH RCDG
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of Terminals
    30
  • Terminal Pitch (mm)
    0.635
  • Reading Time-Max (s)
    35
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Current-Max (mA)
    12
  • Package Equivalence Code
    SSOP30,.3
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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ML22Q321-XXXMB
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ML22Q321-XXXMB