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MH88422-1

ZARLINK SEMICONDUCTOR INC

MH88422-1 Datasheet
ZARLINK SEMICONDUCTOR INC MH88422-1
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    HYBRID
  • Width (mm)
    22.86
  • JESD-30 Code
    R-XDIP-T23
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Telecom IC Type
    MODEM-SUPPORT CIRCUIT
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    23
  • Terminal Pitch (mm)
    2.54
  • Package Body Material
    UNSPECIFIED
  • Seated Height-Max (mm)
    6.9
  • Supply Voltage-Nom (V)
    5
  • Supply Current-Max (mA)
    0.005
  • Package Equivalence Code
    DIP26,1
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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MH88422-1
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MH88422-1