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MF31M1-L9DATXX

Mitsubishi Electric Corp.

Mitsubishi Electric Corp. MF31M1-L9DATXX
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • Memory Width
    16
  • Surface Mount
    NO
  • Memory IC Type
    SRAM CARD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Memory Organization
    512KX16
  • Number of Terminals
    68
  • Access Time-Max (ns)
    200
  • Number of Words Code
    512K
  • Memory Density (bits)
    8388608
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    8
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    524288
  • Standby Current-Max (A)
    0.00065
  • Supply Current-Max (mA)
    200
  • Package Equivalence Code
    CARD68
  • Operating Temperature-Max (Cel)
    55
  • Operating Temperature-Min (Cel)
    -55

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MF31M1-L9DATXX
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MF31M1-L9DATXX