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MDS213CG

ZARLINK SEMICONDUCTOR INC

ZARLINK SEMICONDUCTOR INC MDS213CG
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • Width (mm)
    35
  • Length (mm)
    35
  • JESD-30 Code
    S-PBGA-B456
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Telecom IC Type
    LAN SWITCHING CIRCUIT
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    456
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.46
  • Supply Voltage-Nom (V)
    2.5
  • Package Equivalence Code
    BGA456,26X26,50
  • Peak Reflow Temperature (Cel)
    225
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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MDS213CG
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MDS213CG