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MD3831-D16-V3Q18-P

SANDISK CORP.

SANDISK CORP. MD3831-D16-V3Q18-P
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    9
  • Length (mm)
    12
  • JESD-30 Code
    R-PBGA-B69
  • Package Code
    LFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    69
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.3
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.7
  • Supply Voltage-Nom (V)
    3.3
  • External Data Bus Width
    16
  • Host Interface Standard
    ISA
  • uPs/uCs/Peripheral ICs Type
    SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0
  • Host Data Transfer Rate-Max (MBps)
    13.3

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MD3831-D16-V3Q18-P