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MD16R162GEG0-CT9

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. MD16R162GEG0-CT9
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.36
  • SB Code
    8542.32.00.23
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Access Mode
    BLOCK ORIENTED PROTOCOL
  • JESD-30 Code
    R-XDMA-N232
  • Memory Width
    32
  • Organization
    128MX32
  • Package Code
    DIMM
  • Self Refresh
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    NO
  • Terminal Form
    NO LEAD
  • Memory Density
    4294967296 bit
  • Memory IC Type
    RAMBUS DRAM MODULE
  • Operating Mode
    SYNCHRONOUS
  • Refresh Cycles
    16384
  • Terminal Pitch
    1 mm
  • Access Time-Max
    32 ns
  • Number of Ports
    1
  • Number of Words
    134217728 words
  • Terminal Position
    DUAL
  • Additional Feature
    SELF CONTAINED REFRESH
  • Supply Current-Max
    3640 mA
  • Number of Functions
    1
  • Number of Terminals
    232
  • Standby Current-Max
    1.436 Amp
  • Number of Words Code
    128M
  • Qualification Status
    Not Qualified
  • Package Body Material
    UNSPECIFIED
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    DIMM232,40
  • Supply Voltage-Max (Vsup)
    2.63 V
  • Supply Voltage-Min (Vsup)
    2.37 V
  • Supply Voltage-Nom (Vsup)
    2.5 V

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MD16R162GEG0-CT9
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MD16R162GEG0-CT9