ProductsManufacturers
Events
Send an RFQBOM Tool

MCM69L819AZP9.5

Freescale Semiconductor, Inc.

Freescale Semiconductor, Inc. MCM69L819AZP9.5
  • ECCN
    3A991
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Width
    14 mm
  • Length
    22 mm
  • Technology
    BICMOS
  • JESD-30 Code
    R-PBGA-B119
  • Memory Width
    18
  • Organization
    256KX18
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    4718592 bit
  • Memory IC Type
    CACHE SRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1.27 mm
  • Access Time-Max
    9.5 ns
  • Number of Words
    262144 words
  • Parallel/Serial
    PARALLEL
  • Seated Height-Max
    2.4 mm
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    119
  • Number of Words Code
    256K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    3.15 V
  • Supply Voltage-Nom (Vsup)
    3.3 V

0 suppliers available to buy or to bid for MCM69L819AZP9.5

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
MCM69L819AZP9.5
Send an RFQ
MCM69L819AZP9.5