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MCM67D709FN16

Motorola,Inc.

Motorola,Inc. MCM67D709FN16
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • I/O Type
    COMMON
  • Technology
    BICMOS
  • Width (mm)
    19.1262
  • Length (mm)
    19.1262
  • JESD-30 Code
    S-PQCC-J52
  • Memory Width
    9
  • Package Code
    QCCJ
  • Output Enable
    YES
  • Package Shape
    SQUARE
  • Package Style
    CHIP CARRIER Meter
  • Surface Mount
    YES
  • Terminal Form
    J BEND
  • J-STD-609 Code
    e0
  • Memory IC Type
    APPLICATION SPECIFIC SRAM
  • Operating Mode
    SYNCHRONOUS
  • Number of Ports
    1
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Additional Feature
    SELF-TIMED WRITE; DUAL I/O FOR SEPARATE PROCESSOR AND MEMORY BUSES
  • Memory Organization
    128KX9
  • Number of Functions
    1
  • Number of Terminals
    52
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    6
  • Number of Words Code
    128K
  • Memory Density (bits)
    1179648
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    4.57
  • Supply Voltage-Max (V)
    5.25
  • Supply Voltage-Min (V)
    4.75
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    131072
  • Supply Current-Max (mA)
    280
  • Package Equivalence Code
    LDCC52,.8SQ
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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MCM67D709FN16