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MCM63D836VF100

Motorola,Inc.

Motorola,Inc. MCM63D836VF100
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B209
  • Memory Width
    36
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Memory IC Type
    MULTI-PORT SRAM
  • Operating Mode
    SYNCHRONOUS
  • Number of Ports
    2
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    256KX36
  • Number of Terminals
    209
  • Terminal Pitch (mm)
    1
  • Access Time-Max (ns)
    5
  • Number of Words Code
    256K
  • Memory Density (bits)
    9437184
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    262144
  • Standby Current-Max (A)
    0.1
  • Standby Voltage-Min (V)
    3.14
  • Supply Current-Max (mA)
    350
  • Package Equivalence Code
    BGA209,11X19,40
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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MCM63D836VF100