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MCIMX515DJK8C

Freescale Semiconductor, Inc.

Freescale Semiconductor, Inc. MCIMX515DJK8C
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.70
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B527
  • Package Code
    FBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Terminal Finish
    TIN SILVER COPPER OVER NICKEL
  • DLA Qualification
    Not Qualified
  • Terminal Position
    BOTTOM
  • Number of Terminals
    527
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom (V)
    1.2
  • Package Equivalence Code
    BGA527,25X25,20
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    SoC
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    40

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MCIMX515DJK8C