MCIMX31LCVMN4CR2 by Freescale Semiconductor, Inc. | Sourcengine

Freescale Semiconductor, Inc. MCIMX31LCVMN4CR2

Lifecycle status
Discontinued
RoHS
RoHS compliant
REACH
REACH compliant
Description
CMOS, PBGA473
Category
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs SYSTEM ON CHIP

ECCN
5A002.A
ECCN Governance
EAR
HTS Code
8542.31.00.01
SB Code
8542.31.00.00

Width
19 mm
Length
19 mm
Technology
CMOS
JESD-30 Code
S-PBGA-B473
Package Code
LFBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
Terminal Pitch
0.8 mm
Terminal Finish
TIN SILVER COPPER OVER NICKEL
Seated Height-Max
1.54 mm
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Supply Voltage-Max
1.47 V
Supply Voltage-Min
1.22 V
Supply Voltage-Nom
1.4 V
Number of Terminals
473
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
BGA473,23X23,32
Operating Temperature-Max
85 Cel
Operating Temperature-Min
-40 Cel
Moisture Sensitivity Level
3
uPs/uCs/Peripheral ICs Type
SYSTEM ON CHIP
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
40