Freescale Semiconductor, Inc. MC68MH360ZP33LR2
  • ECCN
    3A991
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Technology
    HCMOS
  • Width (mm)
    25
  • Length (mm)
    25
  • JESD-30 Code
    S-PBGA-B357
  • Package Code
    BGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Low Power Mode
    YES
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Address Bus Width
    32
  • Bus Compatibility
    68000
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    357
  • Terminal Pitch (mm)
    1.27
  • Number of Serial I/Os
    4
  • Package Body Material
    PLASTIC/EPOXY
  • Communication Standard
    ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC
  • Seated Height-Max (mm)
    1.86
  • Supply Voltage-Max (V)
    5.25
  • Supply Voltage-Min (V)
    4.75
  • Supply Voltage-Nom (V)
    5
  • External Data Bus Width
    32
  • Clock Frequency-Max (MHz)
    33.34
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    SERIAL IO/COMMUNICATION CONTROLLER, LAN
  • Data Encoding/Decoding Method
    NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL
  • Data Transfer Rate-Max (MBps)
    1.25
  • Peak Reflow Temperature (Cel)
    220
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    30

0 suppliers available to buy or to bid for MC68MH360ZP33LR2

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
MC68MH360ZP33LR2
Send an RFQ
MC68MH360ZP33LR2