Freescale Semiconductor, Inc. MC68360CZP25LR2
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Technology
    CMOS
  • Width (mm)
    25
  • Length (mm)
    25
  • RAM (words)
    2560
  • JESD-30 Code
    S-PBGA-B357
  • Package Code
    BGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Low Power Mode
    YES
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Address Bus Width
    32
  • Bus Compatibility
    68000
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    ALSO OPERATES AT 5 V SUPPLY
  • Number of I/O Lines
    46
  • Number of Terminals
    357
  • Terminal Pitch (mm)
    1.27
  • Number of Serial I/Os
    4
  • Package Body Material
    PLASTIC/EPOXY
  • Communication Standard
    ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC
  • Number of DMA Channels
    2
  • On Chip Data RAM Width
    8
  • Seated Height-Max (mm)
    1.86
  • Supply Voltage-Max (V)
    3.3
  • Supply Voltage-Min (V)
    2.7
  • Supply Voltage-Nom (V)
    3
  • External Data Bus Width
    32
  • Supply Current-Max (mA)
    250
  • Package Equivalence Code
    BGA357,19X19,50
  • Clock Frequency-Max (MHz)
    25
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    SERIAL IO/COMMUNICATION CONTROLLER, LAN
  • Data Encoding/Decoding Method
    NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL
  • Data Transfer Rate-Max (MBps)
    10
  • Peak Reflow Temperature (Cel)
    220
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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MC68360CZP25LR2