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MBM29F200TC-70PF

Fujitsu Semiconductor America, Inc.

Fujitsu Semiconductor America, Inc. MBM29F200TC-70PF
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Boot Block
    TOP
  • Technology
    CMOS
  • Width (mm)
    13
  • Length (mm)
    28.45
  • JESD-30 Code
    R-PDSO-G44
  • Memory Width
    16
  • Package Code
    SOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Additional Feature
    CONFIGURABLE AS 128K X 16; 100000 WRITE/ERASE CYCLES MIN
  • Memory Organization
    128KX16
  • Number of Functions
    1
  • Number of Terminals
    44
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    70
  • Number of Words Code
    128K
  • Memory Density (bits)
    2097152
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    8
  • Seated Height-Max (mm)
    2.5
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    131072
  • Programming Voltage (V)
    5
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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MBM29F200TC-70PF
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MBM29F200TC-70PF